Over 100+ years of hands-on experience to contribute value add inputs during initial discussion of product layout, performance, form factor and pricing roadmaps

Silitronics engineering team have over 100+ years of hands-on experience to contribute value add inputs during initial discussion of product layout, performance, form factory and pricing roadmaps. A few selected Customer Projects successfully developed by Silitronics Team:

Layout and Fabrication of 4-2-4 Build Up Flip Chip package, Automatic Ball Attach, PCBA including FCBGA package for FinTech Application

Engineering inputs on layout of complicated build up substrate for 4 flip chip ICs, 1 Interposer, 4 wire bond ICs, over 1000 wires per SiP modules and Thermocompression Flip Chips, Cloud Application

Complicated Automatic Pick and Place with +/- 5.0um accuracy and 3600 wire bonds per SiP Module for Quantum Computing Application

Assembly process modification and optimization of ICs with Optics, Silicon Siffner to maximize flaness, 470 wires, Test before and after assembly for LiDAR Application

Tx and Rx Modules including +/-3um placement, controlled Pitch, Yaw and Roll, 3mil loop height, mix of Ribbon and Wedge Bonding for Silicon Photonics Application

MMIC RF and COB assembly optimizations for placement, BOM and Thermal Hierarchy for 5G, Defense and Space Application

Multi Chip Modules (MCM) on Long Flex Assembly on very tight space for Medical Applications

Your One-Stop Partner for
Advanced Semiconductor IC Packaging

Over 100+ years of hands-on experience to contribute value add inputs during initial discussion of product layout, performance, form factor and pricing roadmaps

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