Advanced Semiconductor and Photonics
Packaging Expertise—All in One Place
Design
- Schematic,Layout,Fab
- Package/Board SI/PI
- Thermal & Mechanical
Fabrication
- 7-2-7,90mm x 90mm
- 15/15 Std,10/10 Eng
- Build Up & Ceramic
Dicing
- Stealth Laser for PIC
- Wafer Dicing, Thinning
- Polishing and AOI of PICs
Silicon Photonics
- FAU Active alignment
- Edge Coupling for 1x24 FAU
- Beam Characterization
Assembly
- +/- 0.5µm placement
- 19,000+ bumps Flip Chip
- 9 chips per SiP Module
Chiplets
- Chiplet Floor Planning
- Layer Stack Optimization
- Heterogeneous Assembly
Advanced Semiconductor and Photonics Packaging Expertise—All in One Place
Design
- Schematic, Layout, Fab
- Package/Board SI/PI
- Thermal & Mechanical
Fabrication
- 7-2-7,90mm x 90mm
- 15/15 Std,10/10 Eng
- Build Up & Ceramic
Dicing
- Stealth Laser for PIC
- Wafer Dicing, Thinning
- Polishing and AOI of PICs
Silicon Photonics
- FAU Active alignment
- Edge Coupling for 1x24 FAU
- Beam Characterization
Assembly
- +/- 0.5µm placement
- 19,000+ bumps Flip Chip
- 9 chips per SiP Module
Chiplets
- Chiplet Floor Planning
- Layer Stack Optimization
- Heterogeneous Assembly
Build With The Best
The Silitronics team brings 100+ years of collective expertise in architecting designing, developing, and executing cost-effective, high-precision semiconductors and photonics packaging solutions—from initial concept to full-scale production.
Silitronics is a state-of-the-art, 20,000 sq ft automated ISO 9001 facility in San Jose, the heart of Silicon Valley, we ensure complicated process development including automated photonics active alignment, seamless scalability, and quality, consistently meeting the most demanding schedules and exceeding performance expectations.
Made in USA
Complete Turnkey Solutions
First Time Right
Prototype to Volume
Made in USA
Complete Turnkey Solutions
First Time Right
Prototype to Volume
Our Services Spectrum
Early Packaging Architecture
Exploration and Feasibility Analysis
With our advanced engineering and manufacturing expertise, we can
engage with
you at the earliest stages of product definition ,
review the product
architecture together, with a path to volume
production.
Comprehensive
PRD Development
Package
architecture Review
Cost, yield, quality
and Scalability Considerations
Rapid Prototyping and Turnkey Designs
We have in-house expertise to assist in all aspects of your
product
development, from rapid prototyping to turnkey
solutions across many
industries and applications.
Heterogeneous
Integration
Silicon
Photonics
MLO/mSAP/SLP/HDI
Test and
Characterization boards
Embedded systems
Engineering Evaluation and Review
for DFM, DFA & DFQ
Silitronics utilizes state of the art CAD tools to design next
generation
packaging and silicon photonics solutions. We specialize
in Multiphysics
analysis to ensure your products meet all of the SOW requirements and is
optimized for first-pass success.
Zemax
modeling
SI/PI & Thermal
Simulation
Chip-Package-
PCB Co-Design
High-Speed Layout &
Stack-up Optimization
Substrate Design and Fabrication
after DFM
We can fabricate build-up MLO substrates, mSAP/SLP, HDI boards, both, in house and through our extensive partner network for volume.
Multi-layer Organic
& Ceramic Substrate
High speed low
loss materials
Thin core
Micro-via & Fine-Pitch
Interconnect Processing
Embedded capacitors
Comprehensive IC + PIC
Assembly capabilities
At Silitronics, we have decades of experience assembling complex
packaging
solutions.
1x24 FAU
attachment
+/- 0.5um Active
alignment
Flip-Chip &
Wire Bonding
3D IC Stacking &
SiP Integration
Custom Process Development for Complex IC + PIC Packaging
Silitronics specializes in developing custom semiconductor and photonic packaging processes tailored for multi-chiplet SiP, heterogeneous integration, and ultra-high-speed interconnects.
Sub-Micron
Active Alignment
FAU Design
& Selection
Co-packaged
Optics (CPO)
Tested for Perfection,
Engineered for Reliability
Reliability isn’t an afterthought—it’s engineered
into every package at
Silitronics. Our comprehensive
testing protocols ensure that each
semiconductor and
photonic package meets performance, durability, and
efficiency benchmarks before deployment.
Electrical
Testing
Optical
Validation
Thermal &
Stress Testing
Mil Std 883
Rel Testing
Our Services Spectrum
Early Packaging Architecture
Exploration and Feasibility Analysis
With our advanced engineering and manufacturing expertise, we can engage with you at the earliest stages of product definition, review the product architecture together, with a path to volume production.
Rapid Prototyping and Turnkey Designs
We have in-house expertise to assist in all aspects of your
product development, from
rapid prototyping to turnkey
solutions across many industries and applications
Engineering Evaluation and Review for DFM, DFA & DFQ
Silitronics utilizes state of the art CAD tools to design next
generation packaging and
silicon photonics solutions. We specialize
in Multiphysics analysis to ensure your
products meet all of the SOW
requirements and is optimized for first-pass success.
Substrate Design and Fabrication after DFM
We can fabricate build-up MLO substrates, mSAP/SLP, HDI boards, both, in house and through our extensive partner network for volume
Comprehensive IC + PIC Assembly capabilities
At Silitronics, we have decades of experience assembling complex
packaging solutions.
Custom Process Development for Complex IC + PIC Packaging
Silitronics specializes in developing custom semiconductor and photonic packaging processes tailored for multi-chiplet SiP, heterogeneous integration, and ultra-high-speed interconnects.
Tested for Perfection, Engineered for Reliability
Reliability isn't an afterthought—it's engineered into every package at Silitronics. Our comprehensive testing protocols ensure that each semiconductor and photonic package meets performance, durability, and efficiency benchmarks before deployment.
Selected and trusted by Industry
leaders and Innovative Startups
Silicon Photonics:
Data center, Cloud
AR/VR:
Camera Sensors, Retina
AI/ML /Computing:
Cloud, 800G
LiDAR:
Driverless car, Security
Defense:
High Rel Assembly
IoT Sensors:
SiP Modules, MEMS
Medical:
In Vitro and In Vivo
Silicon Photonics:
Data center, Cloud
AR/VR:
Camera Sensors, Retina
AI/ML/Computing:
Cloud, 800G
LiDAR:
Driverless car, Security
Defense:
High Rel Assembly
IoT Sensors:
SiP Modules, MEMS
Medical:
In Vitro and In Vivo
Why choose Silitronics?
20,000+ sq.ft.
State-of-the-Art
Facility:
Equipped with 10K clean rooms and fully automated assembly lines for unparalleled precision.
One-Stop Solutions
From concept to finished product, we handle it all—design, assembly, testing, and delivery.
Cutting-Edge Equipment
From ±0.5μm flip chip placement to automatic wire bonding at 20μm pitch, we deliver unmatched accuracy.
Industry-Leading Speed
8-hour turnaround for urgent prototypes and 3-day cycle times for standard builds.
Proven
Expertise
99% yield on SiP modules and 90%+ yield on RF and flex assemblies.
Why choose Silitronics?
20,000+ sq.ft.
State-of-the-Art Facility:
Equipped with 10K clean rooms and fully automated assembly lines for unparalleled precision.
One-Stop Solutions
From concept to finished product, we handle it all—design, assembly, testing, and delivery.
Cutting-Edge Equipment
From ±0.5μm flip chip placement to automatic wire bonding at 20μm pitch, we deliver unmatched accuracy.
Industry-Leading Speed
8-hour turnaround for urgent prototypes and 3-day cycle times for standard builds.
Proven Expertise
99% yield on SiP modules and 90%+ yield on RF and flex assemblies.
Case Studies and Whitepapers
Driving Innovation in LiDAR with High-Precision SiP Packaging
Flawless execution, rapid prototyping, and first-pass success for cutting-edge automotive LiDAR technology.
Download case studyAccelerating Innovation in 4K Live Streaming & Gaming Cameras
First-pass success, rapid prototyping, and precision execution for breakthrough imaging technology.
Download case studyHigh-Yield, High-Precision IC Packaging for 5G & RF Innovation
Reliable, flexible, and high-performance IC packaging solutions, ensuring uninterrupted supply and exceptional quality.
Download case studyBreaking the Bottleneck: Silicon Photonics and the Next Leap in High-Speed Data Transfer
How Silicon Photonics is revolutionizing AI clusters, HPC, and next-gen computing by overcoming electrical interconnect limitations.
Download case studyHeterogeneous Integration: Unlocking Next-Gen Semiconductor Performance Beyond Moore's Law
How advanced packaging techniques like 2.5D, 3D IC, and Chiplet integration are driving the semiconductor industry forward.
Download case studySustainable Semiconductor Packaging: Reducing Power, Heat, and Waste in Next-Gen Electronics
How eco-friendly materials, energy-efficient designs, and advanced photonics are driving sustainability in semiconductor manufacturing.
Download case studyGet in touch
Interested in our end-to-end advanced semiconductor and photonics (PIC) packaging solutions?
Share your details for an expert connect.
Silitronics is your trusted one-stop partner for advanced semiconductor and photonics packaging–pushing the boundaries of design, fabrication, and assembly while driving sustainability.
Silitronics Solutions Inc
2388 Walsh Avenue, Santa Clara, CA, 95051
Email: sales@silitronics.com
Phone: +1 408-954-8301,
+1 408-605-1148
Grinding and Dicing Services Inc
925 Berryessa Road - San Jose, CA 95133
Email: sales@dieprepservices.com
Phone: +1 408 451 2000
+1 408 451 2000
© 2025 Silitronics. All rights reserved.
Silitronics is your trusted one-stop partner for advanced semiconductor and photonics packaging-pushing the boundaries of design, fabrication, and assembly while driving sustainability.
Silitronics Solutions Inc 2388 Walsh Avenue, Santa Clara, CA, 95051
Email: sales@silitronics.com
Phone: +1 408-954-8301,
+1 408-605-1148
© 2025 Silitronics. All rights reserved.
