Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

Silicon Photonics Application with +/- 0.5um Active Alignment

  • Ceramic and Organic Boards for Silicon IC, Photonic IC & Optical Assemblies
  • 1860 Bumps + Flip Chip process development
  • 50um low loop wire for capacitance control
  • 300um controlled wire length with ball and ribbon wire bonding
  • Re-design and optimization after learning lessons from prototype build
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