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Home
Design
Package Design
Process Development
Assembly
Final Test
Applications
Silicon Photonics
LiDAR
IoT
AR / VR
AI / ML
Computing
Medical
Defense
About Us
Team
Quality Assurance
Vision
Facility
Contact Us
Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.
100% inside bond pad at front edge
Accuracy: ± 10um, +/- 5um with UV
Die rotation(xy): < 1 degree
Die tilt/flatness (z): < 1.5 degree
Epoxy squeeze out: 3 sides
No squeeze out at the front
BLT: <15um
Fillet height: <50% of thickness
Auto Wedge Bonding, Silicon Photonics, 50um Pitch, 292 wires
Silicon Photonics
IoT
AR / VR
AI / ML
Computing
Medical
Defense
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Advanced Semiconductor IC Packaging
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