Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

  • 100% inside bond pad at front edge
  • Accuracy: ± 10um, +/- 5um with UV
  • Die rotation(xy): < 1 degree
  • Die tilt/flatness (z): < 1.5 degree
  • Epoxy squeeze out: 3 sides
  • No squeeze out at the front
  • BLT: <15um
  • Fillet height: <50% of thickness

Auto Wedge Bonding, Silicon Photonics, 50um Pitch, 292 wires

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