Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

4" x 4" SiP, 4 ICs + 130 SMTs + 3650 Gold Wires

  • 3650 wires per module
  • 10 different wire bonding locations
  • 5 tiers, critical control of loop height + length
  • 20um gold wire
  • 3000 wires die to die
  • 100% encapsulation to protect wore bonds
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