Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

  • 200um thin glass
  • 35 VCSEL + LED 100um
  • 8-hrs cycle time
  • 100% tested yield
  • ACF assembly process for flex and glass substrate
  • Layout flex + glass substrate for DFM + DFA
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Advanced Semiconductor IC Packaging

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