Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

  • Size:
    1.5 inch x 0.5 inch
  • 5 Dies:
    1 image sensor, 2 RF and 2 VCSEL
  • Lens:
    passive alignment + placement
  • Cover:
    pre and post electrical test
  • Assembly:
    CR1K die attach, 264 wires, 3 tiers, low loop
  • Test:
    consigned by customer, 95%+ yield
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