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Home
Design
Package Design
Process Development
Assembly
Final Test
Applications
Silicon Photonics
LiDAR
IoT
AR / VR
AI / ML
Computing
Medical
Defense
About Us
Team
Quality Assurance
Vision
Facility
Contact Us
Layout and Assembly Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.
Size:
1.5 inch x 0.5 inch
5 Dies:
1 image sensor, 2 RF and 2 VCSEL
Lens:
passive alignment + placement
Cover:
pre and post electrical test
Assembly:
CR1K die attach, 264 wires, 3 tiers, low loop
Test:
consigned by customer, 95%+ yield
Silicon Photonics
LiDAR
IoT
AR / VR
Computing
Medical
Defense
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Advanced Semiconductor IC Packaging
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Package Design
Process Development
Assembly
Final Test
Applications
Silicon Photonics
LiDAR
IoT
AV / VR
AI / ML
Computing
Medical
Defence
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