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Wirebonding
Silitronics, specializes in both Thermocompression and Thermosonic
methods of wire bonding
Our capabilities include,
- Gold ball wire bonding from
0.7 mil to 4.5 mil wire
- Gold wedge bonding (0.7 mil
to 4.0mil)
- Wedge bonding from 0.7 mil
to 20 mil aluminum wire
- Gold and Aluminum Ribbon bonding
- Tack bonding for microwave
assembly
- Mesh bonding for microwave
assembly
- Stud bumping is also offered
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