SMT (Surface Mount Technology)
& Cable Assembly

Hybrids, multichip modules, circuit boards, and cable assembly where packaged components are mounted directly onto the surface of the substrate. A layer of solder paste is screen-printed onto the pads and the components are attached by pushing their leads into the paste. When all of the components have been attached, the solder paste is melted using either reflow soldering or vapor-phase soldering.

Our capabilities include:

• Chip or thick film resistors
• Epoxy FR4 or G10 PCB, ceramic substrate or flex circuits
• Components mounted on one or both sides of board or substrate
• Full vision, automated placement system
• 12 mm pitch placement capabilities
• Combination with Hybrid