Latest News: Silitronics has invested in the latest state-of-the-art high precision automatic die pick-&-place equipment. Die can be mounted with an accuracy of +/- 10 micro-meters. We have automated eutectic-attach capability, including direct die pick capability off wafers. Our advanced die placement systems use optimized and programmed die attach forces for effective bondline control. We capitalize on the special die-scrub routines to provide void-free joints for eutectic assembly