Your one-stop partner from Package Design
and Process Development to SiP Assembly

Routing complexity of high speed traces in build up substrate and PCBs
Flip Chip with underfill and ball attach
Wire Bonding Multi Tier
SiP PCBA
Made in USA
Made in
USA
First Time Right
First Time
Right
Innovative Solutions
Innovative Solutions
Prototype to Volume
Prototype to Volume

Our Services
Design, Process Development and Assembly

Silitronics offers value added design and assembly solutions including feasibility studies, material selection, assembly and process development. In particular, design optimization for size and performance in SiP including interposer and Chiplet integration are some examples of unique differentiation we can bring to our customers. Silitronics works closely with customers to understand their product specification and then provide assessments. Silitronics has the domain knowledge, experience and resources to handle a variety of challenges from our customers. Silitronics provides a working prototype with First Time Success and does support its customers to achieve volume production.

Customer Applications

Silitronics works closely with customers to understand their product requirements, suggest alternatives in package/SiP design or optimize process development or suitable assembly flow for the application. Typical engagements will cover following areas:
Starting with netlist and product specifications, develop 2.5D and 3D SiP solutions for Chiplet Integration and New Product Introduction
Optimize package selection for the best performance, price and schedule. Evaluate Test and Reliability Plan to optimize BOM
Package layout followed by in depth SI, PI and Thermal/Mechanical analysis. Design for Assembly analysis to ensure high yield, quality and competitive pricing
Silitronics is equipped with state of the art Assembly Equipment enabling packaging for many end applications

Facility

Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in San Jose, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms.

Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time.

Typical Cycle Time

Examples of Selected SiP Assemblies

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About Silitronics

Silitronics team has expertise and hands on experience to propose, develop and implement cost effective solutions within schedule. Silitronics is centrally located in Silicon Valley, San Jose, CA in a 10,000+ square feet facility with Clean Room 10K and 1K.
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Your One-Stop Partner for
Advanced Semiconductor IC Packaging

Company

Services

Applications

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