Hybrid Assembly

Hybrid assembly involves taking an electronic subsystem in which a number of integrated circuits (packaged and/or unpackaged) and discrete components and attaching them directly to a common substrate. Connections between the components are formed on the surface of the substrate and some components, such as resistors and inductors, may be fabricated directly onto the substrate. Hybrid circuits provide the greatest reduction in size, and can often improve performance of critical circuits

Our capabilities include:

• Multi-layer metallization
• Thick film resistors laser trimmed to 1% or lower
• Alumina or Aluminum Nitride (AIN)
• Epoxy or eutectic die attachment
• Gold ball wire bonding: 0.7 to 4.5 mils
• Aluminum wedge wire bonding: 0.7 to 20 mils
• Ceramic or plastic lids
• Combination SMT and Hybrid