Sealing & Hermetic Packaging

Also known as hermetic encapsulation or sealing is a process of capping the body of the package to ensure 100% protection against moisture. This is used in packages that require a level of performance that conventional epoxy and mechanical seals cannot match.
Silitronics is one of the few subcontract manufacturers offering hermetic and non-hermetic assembly services.

Our capabilities include:

• Seal glass
• B Stage epoxy
• Non-conductive epoxy
• Combo lid solder sealing
• Dam and fill
• Transfer molding
• Gross leak & fine leak test in-house