Wirebonding

Heavy Wirebonding is the process of connecting the pads on an unpackaged integrated circuit to corresponding pads on a substrate using wires that are finer than a human hair.

Wire bonding may also be used to connect the pads on an unpackaged integrated circuit, hybrid, or multichip module to the leads of the component package.

Our capabilities Include:

• Gold ball (from 0.7 to 4.5 mils)
• Aluminum wedge (from 0.7 to 2.0 mils)
• Gold ultrasonic wedge 0.7 mils (for microwave)
• Heavy wire (from 2.0 to 20.0 mils)
• Tack bonding (for microwave)
• Mesh bonding (for microwave)