Flipchip

Flip chip microelectronic assembly is the direct electrical connection of face-down (hence, "flipped") electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. . Flip chip is also called Direct Chip Attach (DCA), Flip chip offers the highest speed electrical performance of any assembly method. Eliminating bond wires reduces the delaying inductance and capacitance of the connection by a factor of 10, and shortens the path by a factor of 25 to 100. The result is high speed off-chip interconnection.

Flip chip connections can use the whole area of the die, accommodating many more connections on a smaller die. Area connections also allow 3-D stacking of die and other components. Flip chip is mechanically the most rugged interconnection method.

Click hear to see diagram 1 & diagram 2