Eutectic Attach

Silitronics, provides excellent process of eutectic die attach for high frequency and high power application.

Eutectic die attach, is essential in hermetic packages using a eutectic alloy to attach the die to the substrate. A eutectic alloy is an alloy with the lowest melting point possible for the metals combined in the alloy.
To optimize the die attachment, the process is performed in an Inert atmosphere.
Common alloys used in eutectic die attach are: Au-Sn , Au-Ge and Au-Si