Die Attached

Also known as Die Mount or Die Bond, is the process of attaching the Silicon chip to the pad of the substrate.
Silitronics, expertise for dispensing or printing the electrically conductive materials and non-conductive epoxies utlizing both automatic as well as manual methods.
Our programmable dispensing patterns and precise volume control can deliver excellent die attach results for critical applications such as MEMS and Microwave assembly.

Silitronics, provides the following range of
capabilities for die attach process:

• Silver Epoxy die attach (Per MIL STD 883)
• Non-Conductive die attach
• Eutectic die attach
• Solder Re-Flow for power devices
• High temperature epoxy die attach
• Silver Glass die attach
• RTV die attach