Chip on Board (COB)

Die are physically and electrically attached to a circuit board, and then encapsulated with a protective material such as epoxy.

We also handle:

Chip on Chip (COC)
A process in which unpackage die are mounted on top of one another. Because each die is very thin, it is possible to integrate over a hundred dies forming a 3D cube.

Chip on Flex (COF)
Similar to chip-on-board (COC), except that the unpackaged integrated circuits are attached to a flexible printed circuit.