BGA and Overmold Services

Silitronics is experienced in providing very fast microelectronics assembly and high quality quickturn BGA packages for small to medium volume production.

Our Capabilities Include:

• Over Mold to Substrate Design & Fabrication Sealing Methods: Epoxy Dam & Fill, Transfer Mold (in 11 to 45 mm sizes) Gold Wedge & Gold Ball.Wire Binding. All Ball Configurations & Ball Sizes.Fine Pitch Wire Bonding with the latest technology (<45micron).Ball Size as small as 0.7mls.
  Open Cavity
  
  

Silitronics will provide substrates or use customer supplied subs.